vishay siliconix si3932dv new product document number: 65736 s10-0642-rev. a, 22-mar-10 www.vishay.com 1 dual n-channel 30 v (d-s) mosfet product summary v ds (v) r ds(on) ( ) i d (a) a q g (typ.) 30 0.058 at v gs = 10 v 3.7 1.8 nc 0.073 at v gs = 4.5 v 3.3 orderin g information: si3932d v -t1-ge3 (lead (p b )-free and halogen-free) t so p-6 top view 6 4 1 2 3 5 2. 8 5 mm 3 mm d2 g2 s1 s2 d1 g1 marking code mh xxx lot tracea b ility and date code part # code n - c h a nn e l m os fet g 1 d 1 s 1 n - c h a nn e l m os fet g 2 d 2 s 2 notes: a. t c = 25 c. b. surface mounted on 1" x 1" fr4 board. c. t = 5 s. d. maximum under steady state conditions is 150 c/w. absolute maximum ratings t a = 25 c, unless otherwise noted parameter symbol limit unit drain-source voltage v ds 30 v gate-source voltage v gs 20 continuous drain current (t j = 150 c) t c = 25 c i d 3.7 a t c = 70 c 3 t a = 25 c 3.4 b, c t a = 70 c 2.7 b, c pulsed drain current i dm 15 continuous source-drain diode current t c = 25 c i s 1.17 t a = 25 c 0.95 b, c maximum power dissipation t c = 25 c p d 1.4 w t c = 70 c 0.9 t a = 25 c 1.14 b, c t a = 70 c 0.73 b, c operating junction and storage temperature range t j , t stg - 55 to 150 c soldering recommendations (peak temperature) d, e 260 thermal resistance ratings parameter symbol typical maximum unit maximum junction-to-ambient b, d t 5 s r thja 93 110 c/w maximum junction-to-foot steady state r thjf 75 90 features ? halogen-free according to iec 61249-2-21 definition ? trenchfet ? power mosfet ? 100 % r g tested ? compliant to rohs directive 2002/95/ec applications ? load switch for portable applications ? dc/dc converters
www.vishay.com 2 document number: 65736 s10-0642-rev. a, 22-mar-10 vishay siliconix si3932dv new product notes: a. pulse test; pulse width 300 s, duty cycle 2 % b. guaranteed by design, not s ubject to production testing. stresses beyond those listed under ?absolute maximum ratings? ma y cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other condit ions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. specifications t j = 25 c, unless otherwise noted parameter symbol test conditions min. typ. max. unit static drain-source breakdown voltage v ds v gs = 0 v, i d = 250 a 30 v v ds temperature coefficient v ds /t j i d = 250 a 29 mv/c v gs(th) temperature coefficient v gs(th) /t j - 4 gate-source threshold voltage v gs(th) v ds = v gs , i d = 250 a 1.2 2.2 v gate-source leakage i gss v ds = 0 v, v gs = 20 v 100 na zero gate voltage drain current i dss v ds = 30 v, v gs = 0 v 1 a v ds = 30 v, v gs = 0 v, t j = 55 c 10 on-state drain current a i d(on) v ds 5 v, v gs = 10 v 10 a drain-source on-state resistance a r ds(on) v gs = 10 v, i d = 3.4 a 0.047 0.058 v gs = 4.5 v, i d = 3.0 a 0.058 0.073 forward transconductance a g fs v ds = 15 v, i d = 3.4 a 10 s dynamic b input capacitance c iss v ds = 15 v, v gs = 0 v, f = 1 mhz 235 pf output capacitance c oss 45 reverse transfer capacitance c rss 16 total gate charge q g v ds = 15 v, v gs = 10 v, i d = 3.4 a 3.7 6 nc v ds = 15 v, v gs = 4.5 v, i d = 3.4 a 1.8 3 gate-source charge q gs 0.74 gate-drain charge q gd 0.42 gate resistance r g f = 1 mhz 1 5 10 tu r n - o n d e l ay t i m e t d(on) v dd = 15 v, r l = 5.6 i d ? 2.7 a, v gen = 4.5 v, r g = 1 10 20 ns rise time t r 15 30 turn-off delay time t d(off) 10 20 fall time t f 10 20 tu r n - o n d e l ay t i m e t d(on) v dd = 15 v, r l = 5.6 i d ? 2.7 a, v gen = 10 v, r g = 1 510 rise time t r 15 30 turn-off delay time t d(off) 10 20 fall time t f 10 20 drain-source body diode characteristics continuous source-drain diode current i s t c = 25 c 1.17 a pulse diode forward current i sm 15 body diode voltage v sd i s = 2.7 a, v gs = 0 v 0.85 1.2 v body diode reverse recovery time t rr i f = 2.7 a, di/dt = 100 a/s, t j = 25 c 10 20 ns body diode reverse recovery charge q rr 410nc reverse recovery fall time t a 6 ns reverse recovery rise time t b 4
document number: 65736 s10-0642-rev. a, 22-mar-10 www.vishay.com 3 vishay siliconix si3932dv new product typical characteristics 25 c, unless otherwise noted output characteristics on-resistance vs. drain current and gate voltage gate charge 0 3 6 9 12 15 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v gs =10vthru4v v gs =3v v gs =2v v ds - drain-to-source voltage (v) - drain current (a) i d 0.00 0.02 0.04 0.06 0.08 0.10 0 3 6 9 12 15 v gs =4.5v v gs =10v - on-resistance ( ) r ds(on) i d - drain current (a) 0 2 4 6 8 10 01234 v ds =24v i d =3.4a v ds =7.5v v ds =15v - gate-to-source voltage (v) q g - total gate charge (nc) v gs transfer characteristics capacitance on-resistance vs. junction temperature 0 1 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 t c = 25 c t c = 125 c t c = - 55 c v gs - gate-to-source voltage (v) - drain current (a) i d c rss 0 50 100 150 200 250 300 0 5 10 15 20 25 30 c iss c oss v ds - drain-to-source voltage (v) c - capacitance (pf) 0.6 0.8 1.0 1.2 1.4 1.6 1.8 - 50 - 25 0 25 50 75 100 125 15 0 i d =3.4a v gs =10v,v gs =4.5v t j - junction temperature (c) (normalized) - on-resistance r ds(on)
www.vishay.com 4 document number: 65736 s10-0642-rev. a, 22-mar-10 vishay siliconix si3932dv new product typical characteristics 25 c, unless otherwise noted source-drain diode forward voltage threshold voltage 0.1 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 t j = 25 c t j = 150 c v sd - source-to-drain voltage (v) - source current (a) i s 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 - 50 - 25 0 25 50 75 100 125 150 i d = 250 a (v) v gs(th) t j - temperature (c) on-resistance vs. gate-to-source voltage single pulse power (junction-to-ambient) 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0246810 t j =25 c i d =3.4a t j = 125 c - on-resistance ( ) r ds(on) v gs - gate-to-source voltage (v) 0 1 2 3 4 5 6 0.01 0.1 1 10 100 1000 time (s) power (w) safe operating area, junction-to-ambient 100 1 0.1 1 10 100 0.01 10 0.1 t a = 25 c single pulse limited by r ds(on) * bvdss limited 1ms 100 s 10 ms v ds - drain-to-source voltage (v) *v gs > minimum v gs at which r ds(on) is specied - drain current (a) i d dc 1s,10s 100 ms
document number: 65736 s10-0642-rev. a, 22-mar-10 www.vishay.com 5 vishay siliconix si3932dv new product typical characteristics 25 c, unless otherwise noted * the power dissipation p d is based on t j(max) = 150 c, using junction-to-case thermal resi stance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. it is used to determ ine the current rating, when this rating falls below the package limit. current derating* 0 1 2 3 4 5 0 255075100125150 package limited t c - case temperature (c) i d - drain current (a) power derating 0.0 0.4 0.8 1.2 1.6 25 50 75 100 125 150 t c - foot temperature (c) power dissipation (w)
www.vishay.com 6 document number: 65736 s10-0642-rev. a, 22-mar-10 vishay siliconix si3932dv new product typical characteristics 25 c, unless otherwise noted vishay siliconix maintains worldwide manufacturing capability. products may be manufactured at one of several qualified locatio ns. reliability data for silicon technology and package reliability represent a composite of all qualified locations. for related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?65736 . normalized thermal transient im pedance, junction-to-ambient 10 -3 10 -2 1 10 1000 10 -1 10 -4 100 0.2 0.1 square wave pulse duration (s) normalized effective transient thermal impedance 1 0.1 0.01 t 1 t 2 notes: p dm 1. duty cycle, d = 2. per unit base = r thja =150 c/w 3. t jm -t a =p dm z thja (t) t 1 t 2 4. surface mounted duty cycle = 0.5 single pulse 0.02 0.05 normalized thermal transient impedance, junction-to-foot 10 -3 10 -2 0 1 1 10 -1 10 -4 0.2 0.1 duty cycle = 0.5 square wave pulse duration (s) normalized effective transient thermal impedance 1 0.1 0.01 0.05 single pulse 0.02
document number: 91000 www.vishay.com revision: 18-jul-08 1 disclaimer legal disclaimer notice vishay all product specifications and data are subject to change without notice. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ?vishay?), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. vishay disclaims any and all li ability arising out of the use or application of any product describ ed herein or of any information provided herein to the maximum extent permit ted by law. the product specifications do not expand or otherwise modify vishay?s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of vishay. the products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. customers using or selling vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify vishay for any damages arising or resulting from such use or sale. please contact authorized vishay personnel to obtain written terms and conditions regarding products designed for such applications. product names and markings noted herein may be trademarks of their respective owners.
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